A method for soldering an LED to a circuit board includes firstly providing a solder-applying pattern overlaying the circuit board. First holes and second holes are defined in the solder-applying patter. Then, solder pastes are filled in the first holes and the second holes. The solder-applying pattern is removed and a plurality of first solder poles and second solder poles are remained on the circuit board. An LED is then put on the first solder poles and the second solder poles. The first solder poles and the second solder poles are heated to form a first solder ball and a second solder ball respectively after the heated first and second solder poles are cooled. The first and second solder balls electrically connect positive and second electrodes of the LED with the circuit board.