Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
-
Application No.: US13014212Application Date: 2011-01-26
-
Publication No.: US08400832B2Publication Date: 2013-03-19
- Inventor: Masato Endo
- Applicant: Masato Endo
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-018887 20100129
- Main IPC: G11C11/34
- IPC: G11C11/34 ; H01L29/76

Abstract:
According to one embodiment, a semiconductor device includes a first circuit unit having first and second interconnects, a second circuit unit having third and fourth interconnects, and an intermediate unit provided therebetween and having first and second transistors juxtaposed to each other along a direction perpendicular to a direction from the first circuit unit toward the second circuit unit. A high impurity concentration region in a first connection region of one diffusion layer of the first transistor is connected to the first interconnect, and other diffusion layer is connected to the third interconnect. A distance from the first connection region to a gate is longer than a distance from the second connection region to a gate. An midpoint region with a narrower width than the first connection region is provided between the gate and the first connection region of the one diffusion layer of the first transistor.
Public/Granted literature
- US20110188309A1 SEMICONDUCTOR DEVICE Public/Granted day:2011-08-04
Information query