Invention Grant
- Patent Title: Slider top bond design with shorted pad configuration
- Patent Title (中): 滑块顶部焊接设计,具有短路焊盘配置
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Application No.: US12509946Application Date: 2009-07-27
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Publication No.: US08400736B2Publication Date: 2013-03-19
- Inventor: Michael Allen Greminger , Jon Karsten Klarqvist
- Applicant: Michael Allen Greminger , Jon Karsten Klarqvist
- Applicant Address: US CA Scotts Valley
- Assignee: Seagate Technology, LLC
- Current Assignee: Seagate Technology, LLC
- Current Assignee Address: US CA Scotts Valley
- Agency: Fredrikson & Byron, P.A.
- Main IPC: G11B21/21
- IPC: G11B21/21 ; G11B5/60

Abstract:
An assembly includes a slider having an air bearing surface and a slider mounting surface opposite the air bearing surface. The slider mounting surface includes first, second, third, and fourth slider pads. A first slider trace electrically shorts the first slider pad with the third slider pad. A second slider trace electrically shorts the second slider pad with the fourth slider pad. A transducing head is supported by the slider. The transducing head includes a positive terminal electrically connected to the first slider pad and a negative terminal electrically connected to the second slider pad. The first, second, third, and fourth slider pads can be connected to pads on a connection circuit with interleaved traces.
Public/Granted literature
- US20110019311A1 TOP BOND DESIGN FOR PERFORMANCE ENHANCEMENT Public/Granted day:2011-01-27
Information query
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