Invention Grant
US08399340B2 Method of manufacturing super-junction semiconductor device 有权
超结半导体器件的制造方法

  • Patent Title: Method of manufacturing super-junction semiconductor device
  • Patent Title (中): 超结半导体器件的制造方法
  • Application No.: US13157764
    Application Date: 2011-06-10
  • Publication No.: US08399340B2
    Publication Date: 2013-03-19
  • Inventor: Akihiko Ohi
  • Applicant: Akihiko Ohi
  • Applicant Address: JP Kawasaki
  • Assignee: Fuji Electric Co., Ltd.
  • Current Assignee: Fuji Electric Co., Ltd.
  • Current Assignee Address: JP Kawasaki
  • Priority: JP2010-135185 20100614
  • Main IPC: H01L21/00
  • IPC: H01L21/00
Method of manufacturing super-junction semiconductor device
Abstract:
A method of manufacturing a super-junction semiconductor device facilitates increasing the epitaxial growth rate without increasing the manufacturing steps greatly. In substitution for the formation of alignment mark in the surfaces of the second and subsequent non-doped epitaxial layers, patterning for forming a new alignment mark is conducted simultaneously with the resist pattering for selective ion-implantation into the second and subsequent non-doped epitaxial layers in order to form the new alignment mark at a position different from the position, at which the initial alignment mark is formed, and to form the new alignment mark in every one or more repeated epitaxial layer growth cycles.
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