Invention Grant
- Patent Title: Method of manufacturing memory devices
- Patent Title (中): 制造存储器件的方法
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Application No.: US12785500Application Date: 2010-05-24
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Publication No.: US08399326B2Publication Date: 2013-03-19
- Inventor: Ta-Wei Lin , Wen-Jer Tsai
- Applicant: Ta-Wei Lin , Wen-Jer Tsai
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX International Co., Ltd.
- Current Assignee: MACRONIX International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/311

Abstract:
Disclosed is a memory device and method of operation thereof. The memory device may include a source region and a drain region of a first dopant type, the source and drain regions contain a first semiconductor material; a body region of a second dopant type, the body region being sandwiched between the source and drain regions, the body comprising a second semiconductor material; a gate dielectric layer over at least the body region; and a gate comprising a conductive material over the gate dielectric layer. Specifically, one of the first semiconductor material and the second semiconductor material is lattice matched with the other of the first semiconductor material and the second semiconductor material and has an energy gap smaller than the energy gap of the other of the first semiconductor material and the second semiconductor material.
Public/Granted literature
- US20100227441A1 METHOD OF MANUFACTURING MEMORY DEVICES Public/Granted day:2010-09-09
Information query
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