Invention Grant
- Patent Title: Methods of forming and assembling pre-encapsulated assemblies and of forming associated semiconductor device packages
- Patent Title (中): 形成和组装预封装组件和形成相关半导体器件封装的方法
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Application No.: US13277988Application Date: 2011-10-20
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Publication No.: US08399297B2Publication Date: 2013-03-19
- Inventor: Tay Wuu Yean , Wang Ai-Chie
- Applicant: Tay Wuu Yean , Wang Ai-Chie
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Priority: SG200803157-7 20080424
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Methods of forming pre-encapsulated frames comprise flowing a dielectric encapsulation material around at least one conductive trace. A cavity configured to receive at least one semiconductor device at least partially in the cavity is formed in the encapsulation material. A first connection area of the at least one trace is exposed within the cavity. At least another connection area of the at least one trace is exposed laterally adjacent to the cavity. The dielectric encapsulation material is hardened to form a pre-encapsulated frame.
Public/Granted literature
- US20120034740A1 PRE-ENCAPSULATED CAVITY INTERPOSER Public/Granted day:2012-02-09
Information query
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