Invention Grant
US08399267B2 Methods for packaging light emitting devices and related microelectronic devices 有权
用于封装发光器件和相关微电子器件的方法

  • Patent Title: Methods for packaging light emitting devices and related microelectronic devices
  • Patent Title (中): 用于封装发光器件和相关微电子器件的方法
  • Application No.: US12977248
    Application Date: 2010-12-23
  • Publication No.: US08399267B2
    Publication Date: 2013-03-19
  • Inventor: Peiching Ling
  • Applicant: Peiching Ling
  • Applicant Address: US CA Santa Clara
  • Assignee: Achrolux Inc
  • Current Assignee: Achrolux Inc
  • Current Assignee Address: US CA Santa Clara
  • Agency: Turocy & Watson, LLP
  • Main IPC: H01L21/00
  • IPC: H01L21/00
Methods for packaging light emitting devices and related microelectronic devices
Abstract:
A method for forming a light emitting device includes providing a light emitting diode (LED) configured to emit light of a first color and providing a plurality of semi-spherical lenses made of a silicone material that contains no phosphor material. Each of the lenses has a layer of phosphor material attached thereto. The method also includes testing the plurality of lenses to select a subset of lenses that converts light of the first color to light of a second color. The method further includes forming the light emitting device using the LED, one of the selected subset of lenses, and a heat conductive substrate. In an embodiment, after the testing of the plurality of lenses, one of the selected subset of lenses is disposed overlying the LED. In another embodiment, the testing of the plurality of lenses is conducted with a light source other than the LED.
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