Invention Grant
US08399263B2 Method for measuring expansion/contraction, method for processing substrate, method for producing device, apparatus for measuring expansion/contraction, and apparatus for processing substrate
有权
用于测量膨胀/收缩的方法,基板的处理方法,装置的制造方法,膨胀/收缩测量装置以及基板的处理装置
- Patent Title: Method for measuring expansion/contraction, method for processing substrate, method for producing device, apparatus for measuring expansion/contraction, and apparatus for processing substrate
- Patent Title (中): 用于测量膨胀/收缩的方法,基板的处理方法,装置的制造方法,膨胀/收缩测量装置以及基板的处理装置
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Application No.: US12551057Application Date: 2009-08-31
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Publication No.: US08399263B2Publication Date: 2013-03-19
- Inventor: Tohru Kiuchi , Hideo Mizutani
- Applicant: Tohru Kiuchi , Hideo Mizutani
- Applicant Address: JP Tokyo
- Assignee: Nikon Corporation
- Current Assignee: Nikon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Main IPC: H01L21/66
- IPC: H01L21/66

Abstract:
An expansion/contraction measuring apparatus includes a transport section which transports a flexible substrate along a surface of the substrate; a detecting section detecting first and second marks which are formed on the substrate while being separated from each other by a predetermined spacing distance in a transport direction of the substrate and which are moved, in accordance with the transport of the substrate, to first and second detection areas disposed on a transport route for the substrate respectively; a substrate length setting section which sets a length of the substrate along the transport route between the first and second detection areas to a reference length; and a deriving section which derives information about expansion/contraction of the substrate in relation to the transport direction based on a detection result of the first and second marks. Accordingly, the expansion/contraction state of an expandable/contractible substrate is measured highly accurately.
Public/Granted literature
Information query
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