Invention Grant
- Patent Title: Resist composition and resist pattern forming method
- Patent Title (中): 抗蚀剂组成和抗蚀剂图案形成方法
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Application No.: US11996044Application Date: 2006-05-18
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Publication No.: US08399173B2Publication Date: 2013-03-19
- Inventor: Shoichi Fujita , Kazuyuki Nitta , Tomoharu Takahashi , Hirokazu Ozaki
- Applicant: Shoichi Fujita , Kazuyuki Nitta , Tomoharu Takahashi , Hirokazu Ozaki
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2005-210064 20050720
- International Application: PCT/JP2006/309897 WO 20060518
- International Announcement: WO2007/010666 WO 20070125
- Main IPC: G03C1/00
- IPC: G03C1/00 ; G03F7/00
Abstract:
The present invention provides a resist composition prepared by dissolving components in an organic solvent containing ethyl lactate, which suppresses deterioration of sensitivity with time and also has required lithographic characteristics, and a method for forming a resist pattern. The resist composition is prepared by dissolving a resin component (A) which exhibits changeable alkali solubility under an action of an acid, an acid generator component (B) which generates an acid upon exposure, an amine (D) and acetic acid in an organic solvent (S) containing ethyl lactate.
Public/Granted literature
- US20090258313A1 RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD Public/Granted day:2009-10-15
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