- Patent Title: Grinding wheel truing tool and manufacturing method thereof, and truing apparatus, method for manufacturing grinding wheel and wafer edge grinding apparatus using the same
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Application No.: US12332136Application Date: 2008-12-10
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Publication No.: US08398464B2Publication Date: 2013-03-19
- Inventor: Yong-Dug Kim , Gye-Je Cho , Mun-Suk Yong , Hwan-Yun Jung , Kyung-Moo Lee , Dong-Hwan Hyun , Jae-Young Kim
- Applicant: Yong-Dug Kim , Gye-Je Cho , Mun-Suk Yong , Hwan-Yun Jung , Kyung-Moo Lee , Dong-Hwan Hyun , Jae-Young Kim
- Applicant Address: KR Gumi
- Assignee: Siltron, Inc.
- Current Assignee: Siltron, Inc.
- Current Assignee Address: KR Gumi
- Agency: Greer, Burns & Crain, Ltd.
- Priority: KR10-2007-0131306 20071214
- Main IPC: B24B9/00
- IPC: B24B9/00

Abstract:
The present invention relates to a grinding wheel truing tool, its manufacturing method, and a truing apparatus, a method for manufacturing a grinding wheel and a wafer edge grinding apparatus using the same. The grinding wheel truing tool of the present invention compensates a groove of a fine-grinding wheel for fine-grinding a wafer edge, and includes a truer having an edge of the same angle as a slanted surface of the groove of the fine-grinding wheel and a cross-sectional shape corresponding to a cross-sectional shape of the groove. The present invention uses the truing tool to easily process the groove of the grinding wheel for fine-grinding the wafer edge.
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