Invention Grant
- Patent Title: Modular base-plate semiconductor polisher architecture
- Patent Title (中): 模块化底板半导体抛光机架构
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Application No.: US12490928Application Date: 2009-06-24
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Publication No.: US08398458B2Publication Date: 2013-03-19
- Inventor: Alpay Yilmaz
- Applicant: Alpay Yilmaz
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: B24B49/00
- IPC: B24B49/00
Abstract:
The present invention generally relates to a polishing system. Particularly, the present invention relates a polishing apparatus having one or more modular polishing stations, and a plurality of polishing heads movably connected to a transferring system.
Public/Granted literature
- US20100003902A1 MODULAR BASE-PLATE SEMICONDUCTOR POLISHER ARCHITECTURE Public/Granted day:2010-01-07
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