Invention Grant
- Patent Title: Grounding structures for header and receptacle assemblies
- Patent Title (中): 接头和插座组件的接地结构
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Application No.: US13290499Application Date: 2011-11-07
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Publication No.: US08398432B1Publication Date: 2013-03-19
- Inventor: Justin Shane McClellan , Jeffrey Byron McClinton , James Lee Fedder , Nathan William Swanger , Charles S. Pickles , Timothy Robert Minnick , Chad W. Morgan , Dharmendra Saraswat
- Applicant: Justin Shane McClellan , Jeffrey Byron McClinton , James Lee Fedder , Nathan William Swanger , Charles S. Pickles , Timothy Robert Minnick , Chad W. Morgan , Dharmendra Saraswat
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
A receptacle assembly includes a contact module having a conductive holder has a first side and an opposite second side. The conductive holder has a chamber between the first and second sides. A frame assembly is received in the chamber of the conductive holder. The frame assembly includes a plurality of contacts and a dielectric frame supporting the contacts. The contacts extend from the conductive holder for electrical termination. A ground lead frame is received in the chamber between the frame assembly and the conductive holder. The ground leadframe has grounding members that extend from the conductive holder for electrical termination to header shields of the header assembly.
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