Invention Grant
US08398365B2 Modular fan units with sound attenuation layers for an air handling system
有权
具有空气处理系统声音衰减层的模块化风扇单元
- Patent Title: Modular fan units with sound attenuation layers for an air handling system
- Patent Title (中): 具有空气处理系统声音衰减层的模块化风扇单元
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Application No.: US13293301Application Date: 2011-11-10
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Publication No.: US08398365B2Publication Date: 2013-03-19
- Inventor: Lawrence G. Hopkins
- Applicant: Lawrence G. Hopkins
- Applicant Address: US OR Tualatin
- Assignee: Huntair, Inc.
- Current Assignee: Huntair, Inc.
- Current Assignee Address: US OR Tualatin
- Agency: The Small Patent Law Group
- Agent Dean D. Small
- Main IPC: F04D25/08
- IPC: F04D25/08

Abstract:
A modular fan array is provided that is configured for use in an air-handling system and configured to deliver air to a ventilation system for at least a portion of a building. The modular fan array comprises a plurality of modular units configured to be stacked adjacent to one another in at least one row or column to form an array. The modular units each include at least an interior surface, a front end and a back end that define a chamber. The modular fan array includes motors and fans positioned in the chambers of the modular units. The fans are located proximate to the front ends of the corresponding chambers. The fans direct air to discharge from the back ends of the chambers. Sound attenuation layers extend along at least a portion of the interior surface of the chambers. The sound attenuation layers are positioned between at least some of the adjacent chambers.
Public/Granted literature
- US20120057962A1 FAN ARRAY FAN SECTION IN AIR-HANDLING SYSTEMS Public/Granted day:2012-03-08
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