Invention Grant
- Patent Title: Linearly distributed semiconductor workpiece processing tool
- Patent Title (中): 线性分布式半导体工件加工工具
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Application No.: US11442511Application Date: 2006-05-26
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Publication No.: US08398355B2Publication Date: 2013-03-19
- Inventor: William Holtkamp , Izya Kremerman , Christopher Hofmeister , Richard Pickreign
- Applicant: William Holtkamp , Izya Kremerman , Christopher Hofmeister , Richard Pickreign
- Applicant Address: US MA Chelmsford
- Assignee: Brooks Automation, Inc.
- Current Assignee: Brooks Automation, Inc.
- Current Assignee Address: US MA Chelmsford
- Agency: Perman & Green, LLP
- Agent Colin C. Durham
- Main IPC: H01L21/677
- IPC: H01L21/677

Abstract:
A substrate processing apparatus includes a transport chamber capable of holding an isolated atmosphere therein and communicably connected to a charging station for loading and unloading a substrate into the apparatus, a transport system inside the transport chamber for transporting the substrate and an array of processing chamber modules distributed alongside the transport chamber and communicably connected to the transport chamber to allow the substrate to be transferred therebetween.
Public/Granted literature
- US20070274810A1 Linearly distributed semiconductor workpiece processing tool Public/Granted day:2007-11-29
Information query
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