Invention Grant
- Patent Title: Optical microphone packaging
- Patent Title (中): 光学麦克风包装
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Application No.: US13025054Application Date: 2011-02-10
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Publication No.: US08391517B2Publication Date: 2013-03-05
- Inventor: Brad D. Avenson , Caesar T. Garcia , Neal Allen Hall , Abidin Guclu Onaran
- Applicant: Brad D. Avenson , Caesar T. Garcia , Neal Allen Hall , Abidin Guclu Onaran
- Applicant Address: US TX Austin
- Assignee: Silicon Audio, Inc.
- Current Assignee: Silicon Audio, Inc.
- Current Assignee Address: US TX Austin
- Agency: Meyertons Hood Kivlin Kowert & Goetzel, P.C.
- Agent Jeffrey C. Hood; Joel L. Stevens
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
An optical microphone that may include a first substrate with one or more acoustic entry ports and a die over the one or more acoustic entry ports. The die may include a sensing structure for detecting acoustic vibrations received via the acoustic entry port(s) and may form a first cavity between the first substrate and the sensing structure. The microphone may include a light source within the first cavity, which may transmit laser light. The optical microphone may include photo detector(s) within the first cavity. The one or more photodetectors may be configured to receive the laser light after reflection from the sensing diaphragm to measure the acoustic vibrations of the sensing diaphragm. The microphone may also include a circuit and a lid, where the die, light source, photo detectors, and circuit are comprised within the cavity of the microphone. The circuit may perform signal processing signals from the photodetector(s).
Public/Granted literature
- US20110194711A1 Optical Microphone Packaging Public/Granted day:2011-08-11
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