Invention Grant
US08391016B2 Carbon nanotube-reinforced solder caps, and chip packages and systems containing same
有权
碳纳米管增强焊锡帽，以及包含其的芯片封装和系统
- Patent Title: Carbon nanotube-reinforced solder caps, and chip packages and systems containing same
- Patent Title (中): 碳纳米管增强焊锡帽，以及包含其的芯片封装和系统
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Application No.: US12583831Application Date: 2009-08-25
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Publication No.: US08391016B2Publication Date: 2013-03-05
- Inventor: Chi-won Hwang
- Applicant: Chi-won Hwang
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- Main IPC: H01L23/488
- IPC: H01L23/488
Abstract:
A carbon nanotube solder is formed on a substrate of an integrated circuit package. The carbon nanotube solder exhibits high heat and electrical conductivities. The carbon nanotube solder is used as a solder microcap on a metal bump for communication between an integrated circuit device and external structures.
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