Invention Grant
- Patent Title: Silicon-ceramic composite substrate
- Patent Title (中): 硅陶瓷复合基板
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Application No.: US12746759Application Date: 2008-12-04
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Publication No.: US08391013B2Publication Date: 2013-03-05
- Inventor: Michael Fischer , Heike Bartsch De Torres , Martin Hoffmann , Jens Müller , Beate Pawlowski , Stefan Barth
- Applicant: Michael Fischer , Heike Bartsch De Torres , Martin Hoffmann , Jens Müller , Beate Pawlowski , Stefan Barth
- Applicant Address: DE Ilmenau DE Munich
- Assignee: Technische Universitat Ilmenau,Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forshung E.V.
- Current Assignee: Technische Universitat Ilmenau,Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forshung E.V.
- Current Assignee Address: DE Ilmenau DE Munich
- Agency: Mayer & Williams PC
- Agent Stuart H. Mayer, Esq.
- Priority: DE102007059609 20071206
- International Application: PCT/EP2008/066837 WO 20081204
- International Announcement: WO2009/071645 WO 20090611
- Main IPC: H05K7/00
- IPC: H05K7/00
Abstract:
A silicon-ceramic composite substrate includes a low-temperature ceramic having at least one pre-formed ceramic layer and a silicon substrate. The low-temperature ceramic forms a carrier layer and the silicon substrate surface has a contact area with nanostructures) that completely penetrate into the low-temperature ceramic.
Public/Granted literature
- US20100254099A1 SILICON-CERAMIC COMPOSITE SUBSTRATE Public/Granted day:2010-10-07
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