Invention Grant
- Patent Title: Heat spreader, electronic apparatus, and heat spreader manufacturing method
- Patent Title (中): 散热器,电子设备和散热器制造方法
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Application No.: US12536996Application Date: 2009-08-06
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Publication No.: US08391007B2Publication Date: 2013-03-05
- Inventor: Mitsuo Hashimoto , Kazuaki Yazawa , Yuichi Ishida , Hiroyuki Ryoson
- Applicant: Mitsuo Hashimoto , Kazuaki Yazawa , Yuichi Ishida , Hiroyuki Ryoson
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JPP2008-206562 20080811
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D15/02

Abstract:
According to an embodiment, there is provided a heat spreader including an evaporation portion, a first condenser portion, a working fluid, and a first flow path. The evaporation portion is arranged in a first position. The first condenser portion is arranged in a second position, the second position being arranged apart from and higher than the first position. The working fluid evaporates from a liquid phase to a gas phase in the evaporation portion, and condenses from the gas phase to the liquid phase in the first condenser portion. The first flow path is made of a nanomaterial, has hydrophobicity on a surface, and causes the working fluid condensed to the liquid phase in the first condenser portion to flow to the evaporation portion by a gravitational force.
Public/Granted literature
- US20100033933A1 HEAT SPREADER, ELECTRONIC APPARATUS, AND HEAT SPREADER MANUFACTURING METHOD Public/Granted day:2010-02-11
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