Invention Grant
US08390783B2 Method of measuring the position of a mask surface along the height direction, exposure device, and exposure method
有权
测量掩模表面沿着高度方向的位置,曝光装置和曝光方法的方法
- Patent Title: Method of measuring the position of a mask surface along the height direction, exposure device, and exposure method
- Patent Title (中): 测量掩模表面沿着高度方向的位置,曝光装置和曝光方法的方法
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Application No.: US12206720Application Date: 2008-09-08
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Publication No.: US08390783B2Publication Date: 2013-03-05
- Inventor: Noriyuki Hirayanagi , Keiichi Tanaka
- Applicant: Noriyuki Hirayanagi , Keiichi Tanaka
- Applicant Address: JP Tokyo
- Assignee: Nikon Corporation
- Current Assignee: Nikon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2004-370393 20041222
- Main IPC: G01B11/00
- IPC: G01B11/00 ; G03B27/42 ; G03B27/52 ; G03B27/54

Abstract:
A method to measure the height-direction position of a mask M in an exposure device having a function to irradiate the mask M with light emitted from a light source and transfer a pattern formed on the mask M onto a photosensitive substrate such as a wafer by a projection optical system, a mask surface height-direction position measurement method characterized by moving, before measuring the height-direction position of the mask M, an exposure area defining member 1 which is installed between the mask M and the projection optical system and defines an exposure area at the time of exposure.
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