Invention Grant
US08390128B2 Semiconductor package and stack semiconductor package having the same
有权
具有相同的半导体封装和堆叠半导体封装
- Patent Title: Semiconductor package and stack semiconductor package having the same
- Patent Title (中): 具有相同的半导体封装和堆叠半导体封装
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Application No.: US12834115Application Date: 2010-07-12
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Publication No.: US08390128B2Publication Date: 2013-03-05
- Inventor: Jong Hyun Nam , Ki Young Kim , Jin Ho Bae
- Applicant: Jong Hyun Nam , Ki Young Kim , Jin Ho Bae
- Applicant Address: KR Gyeonggi-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Ladas & Parry LLP
- Priority: KR10-2009-0135202 20091231
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor package includes a semiconductor chip having a first region defined at a center portion of a first surface of the semiconductor chip, and having second and third regions defined on both sides of the first region, respectively. Bonding pads are disposed in the first region and a substrate having a substrate body is disposed in the second region of the semiconductor chip. The substrate includes an extension portion projecting away from the semiconductor chip. The substrate also includes circuit patterns disposed on the substrate body having a first ends placed adjacent to the bonding pads and second ends placed on the extension portion. Connection members electrically connect the first ends of the circuit patterns and the bonding pads.
Public/Granted literature
- US20110156269A1 SEMICONDUCTOR PACKAGE AND STACK SEMICONDUCTOR PACKAGE HAVING THE SAME Public/Granted day:2011-06-30
Information query
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