Invention Grant
- Patent Title: Integrated circuit packaging system with stacking interconnect and method of manufacture thereof
- Patent Title (中): 具有堆叠互连的集成电路封装系统及其制造方法
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Application No.: US12639984Application Date: 2009-12-16
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Publication No.: US08390108B2Publication Date: 2013-03-05
- Inventor: NamJu Cho , HeeJo Chi , HanGil Shin , Rui Huang , Seng Guan Chow , Heap Hoe Kuan
- Applicant: NamJu Cho , HeeJo Chi , HanGil Shin , Rui Huang , Seng Guan Chow , Heap Hoe Kuan
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/48 ; H01L21/50
Abstract:
A method of manufacture of an integrated circuit packaging system includes: fabricating a base package substrate; coupling a conductive column lead frame to the base package substrate by: providing a lead frame support, patterning a conductive material on the lead frame support including forming an interconnect securing structure, and coupling the conductive material to the base package substrate; forming a base package body between the base package substrate and the conductive column lead frame; and removing the lead frame support from the conductive column lead frame for exposing the interconnect securing structure from the base package body.
Public/Granted literature
- US20110140259A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKING INTERCONNECT AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2011-06-16
Information query
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