Invention Grant
- Patent Title: Semiconductor device and methods of manufacturing semiconductor devices
- Patent Title (中): 半导体装置及制造半导体装置的方法
-
Application No.: US11863290Application Date: 2007-09-28
-
Publication No.: US08390107B2Publication Date: 2013-03-05
- Inventor: Thorsten Meyer
- Applicant: Thorsten Meyer
- Applicant Address: DE Neubiberg
- Assignee: Intel Mobile Communications GmbH
- Current Assignee: Intel Mobile Communications GmbH
- Current Assignee Address: DE Neubiberg
- Agency: SpryIP, LLC
- Main IPC: H01L23/06
- IPC: H01L23/06
Abstract:
This application relates to a semiconductor device comprising a semiconductor chip, a molded body covering the semiconductor chip, wherein the molded body comprises an array of molded structure elements, and first solder elements engaged with the molded structure elements.
Public/Granted literature
- US20090085186A1 Semiconductor Device and Methods of Manufacturing Semiconductor Devices Public/Granted day:2009-04-02
Information query
IPC分类:
