Invention Grant
- Patent Title: Optoisolator leadframe assembly
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Application No.: US12153543Application Date: 2008-05-21
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Publication No.: US08390102B2Publication Date: 2013-03-05
- Inventor: Cheng-Hong Su , Chih-Hung Tzeng
- Applicant: Cheng-Hong Su , Chih-Hung Tzeng
- Applicant Address: CN Guangzhou TW Taipei
- Assignee: Silitek Electronic (Guangzhou) Co., Ltd.,Lite-On Technology Corp.
- Current Assignee: Silitek Electronic (Guangzhou) Co., Ltd.,Lite-On Technology Corp.
- Current Assignee Address: CN Guangzhou TW Taipei
- Agency: Rosenberg, Klein & Lee
- Priority: CN200710032617 20071213
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L31/0203 ; H01L23/495

Abstract:
An optoisolator leadframe assembly includes: an emitter leadframe part including a first rail and a plurality of emitter leadframe units, each rail including two rows of emitter leadframes, each having a die-mounting pad; and a receiver leadframe part including a second rail and a plurality of receiver leadframe units, each including two rows of receiver leadframes, each having a die-mounting pad. The die-mounting pads of the emitter leadframes of each row of each of the emitter leadframe units are respectively aligned with and spaced apart from the die-mounting pads of the receiver leadframes of an adjacent row of an adjacent one of the receiver leadframe units. Each of the emitter and receiver leadframe parts is a single piece.
Public/Granted literature
- US20090152002A1 Optoisolator leadframe assembly Public/Granted day:2009-06-18
Information query
IPC分类: