Invention Grant
- Patent Title: Reducing high-frequency signal loss in substrates
- Patent Title (中): 降低衬底中的高频信号损耗
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Application No.: US13412553Application Date: 2012-03-05
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Publication No.: US08390095B2Publication Date: 2013-03-05
- Inventor: Chewn-Pu Jou , Ho-Hsiang Chen
- Applicant: Chewn-Pu Jou , Ho-Hsiang Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L27/06
- IPC: H01L27/06

Abstract:
An integrated circuit structure includes a semiconductor substrate of a first conductivity type; and a depletion region in the semiconductor substrate. A deep well region is substantially enclosed by the depletion region, wherein the deep well region is of a second conductivity type opposite the first conductivity type. The depletion region includes a first portion directly over the deep well region and a second portion directly under the deep well region. An integrated circuit device is directly over the depletion region.
Public/Granted literature
- US20120161285A1 Reducing High-Frequency Signal Loss in Substrates Public/Granted day:2012-06-28
Information query
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