Invention Grant
- Patent Title: Integration of low and high voltage CMOS devices
- Patent Title (中): 集成低压和高压CMOS器件
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Application No.: US13561710Application Date: 2012-07-30
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Publication No.: US08390077B2Publication Date: 2013-03-05
- Inventor: Jan Sonsky , Anco Heringa
- Applicant: Jan Sonsky , Anco Heringa
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
A semiconductor device includes a semiconductor substrate having a first portion and a second portion and a first transistor of a first type formed in the first portion of the substrate, the first transistor being operable at a first voltage, and the first transistor including a doped channel region of a second type opposite of the first type. The semiconductor device also includes a second transistor of the second type formed in the second portion of the substrate, the second transistor being operable at a second voltage greater than the first voltage, the second transistor including an extended doped feature of the second type. Further, the semiconductor device includes a well of the first type in the semiconductor substrate under a gate of the second transistor, wherein the well does not extend directly under the extended doped feature and the extended doped feature does not extend directly under the well.
Public/Granted literature
- US20120299112A1 Integration of Low and High Voltage CMOS Devices Public/Granted day:2012-11-29
Information query
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