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US08390075B2 Semiconductor memory devices and methods of fabricating the same 有权
半导体存储器件及其制造方法

Semiconductor memory devices and methods of fabricating the same
Abstract:
Semiconductor memory devices and methods of fabricating the semiconductor memory devices are provided, the semiconductor memory devices may include a one-time-programmable (OTP) cell and an electrically erasable programmable read-only memory (EEPROM). The OTP cell includes a memory transistor and a program transistor. The program transistor may include a fuse electrode and may be spaced apart from the memory transistor. The EEPROM cell includes a memory transistor including a first gate and a selection transistor including a second gate. The OTP cell includes a first high-density impurity region which overlaps with the fuse electrode.
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