Invention Grant
US08390064B2 Semiconductor device having gate trenches and manufacturing method thereof
有权
具有栅极沟槽的半导体器件及其制造方法
- Patent Title: Semiconductor device having gate trenches and manufacturing method thereof
- Patent Title (中): 具有栅极沟槽的半导体器件及其制造方法
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Application No.: US12635309Application Date: 2009-12-10
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Publication No.: US08390064B2Publication Date: 2013-03-05
- Inventor: Noriaki Mikasa
- Applicant: Noriaki Mikasa
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-315679 20081211
- Main IPC: H01L29/78
- IPC: H01L29/78

Abstract:
A semiconductor device includes a first gate trench, a second gate trench, and a dummy gate trench provided in an active region extending in an X direction; and a first gate electrode, a second gate electrode, and a dummy gate electrode extending in a Y direction crossing the active region, at least a part of which are buried in the first gate trench, the second gate trench, and the dummy gate trench, respectively. The dummy gate electrode arranged between second and third diffusion layers isolates and separates a transistor constituted by the first gate electrode and first and second diffusion layers provided on both sides of the first gate electrode, respectively, from a transistor constituted by the second gate electrode and third and fourth diffusion layers provided on both sides of the second gate electrode, respectively.
Public/Granted literature
- US20100148248A1 SEMICONDUCTOR DEVICE HAVING GATE TRENCHES AND MANUFACTURING METHOD THEREOF Public/Granted day:2010-06-17
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