Invention Grant
US08390048B2 Method of manufacturing a nonvolatile semiconductor memory device, and a nonvolatile semiconductor memory device
有权
非易失性半导体存储器件的制造方法以及非易失性半导体存储器件
- Patent Title: Method of manufacturing a nonvolatile semiconductor memory device, and a nonvolatile semiconductor memory device
- Patent Title (中): 非易失性半导体存储器件的制造方法以及非易失性半导体存储器件
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Application No.: US12904923Application Date: 2010-10-14
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Publication No.: US08390048B2Publication Date: 2013-03-05
- Inventor: Takeshi Sakai , Yasushi Ishii , Tsutomu Okazaki , Masaru Nakamichi , Toshikazu Matsui , Kyoya Nitta , Satoru Machida , Munekatsu Nakagawa , Yuichi Tsukada
- Applicant: Takeshi Sakai , Yasushi Ishii , Tsutomu Okazaki , Masaru Nakamichi , Toshikazu Matsui , Kyoya Nitta , Satoru Machida , Munekatsu Nakagawa , Yuichi Tsukada
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2004-193554 20040630
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
For enhancing the high performance of a non-volatile semiconductor memory device having an MONOS type transistor, a non-volatile semiconductor memory device is provided with MONOS type transistors having improved performance in which the memory cell of an MONOS non-volatile memory comprises a control transistor and a memory transistor. A control gate of the control transistor comprises an n-type polycrystal silicon film and is formed over a gate insulative film comprising a silicon oxide film. A memory gate of the memory transistor comprises an n-type polycrystal silicon film and is disposed on one of the side walls of the control gate. The memory gate comprises a doped polycrystal silicon film with a sheet resistance lower than that of the control gate comprising a polycrystal silicon film formed by ion implantation of impurities to the undoped silicon film.
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