Invention Grant
- Patent Title: Programmable via devices
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Application No.: US11874582Application Date: 2007-10-18
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Publication No.: US08389967B2Publication Date: 2013-03-05
- Inventor: Kuan-Neng Chen , Sampath Purushothaman
- Applicant: Kuan-Neng Chen , Sampath Purushothaman
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Vazken Alexanian
- Main IPC: H01L29/02
- IPC: H01L29/02

Abstract:
A device comprises a heater, a dielectric layer, a phase-change element, and a capping layer. The dielectric layer is disposed at least partially on the heater and defines an opening having a lower portion and an upper portion. The phase-change element occupies the lower portion of the opening and is in thermal contact with the heater. The capping layer overlies the phase-change element and occupies the upper portion of the opening. At least a fraction of the phase-change element is operative to change between lower and higher electrical resistance states in response to an application of an electrical signal to the heater.
Public/Granted literature
- US20090101882A1 Programmable Via Devices Public/Granted day:2009-04-23
Information query
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