Invention Grant
- Patent Title: Laser processing apparatus and laser processing method
- Patent Title (中): 激光加工设备和激光加工方法
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Application No.: US11916047Application Date: 2006-05-16
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Publication No.: US08389894B2Publication Date: 2013-03-05
- Inventor: Satoshi Ando , Tomobumi Muraoka , Takashi Nire , Akira Matsuno , Tadashi Kurata
- Applicant: Satoshi Ando , Tomobumi Muraoka , Takashi Nire , Akira Matsuno , Tadashi Kurata
- Applicant Address: JP Kanagawa
- Assignee: Phoeton Corp.
- Current Assignee: Phoeton Corp.
- Current Assignee Address: JP Kanagawa
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-162027 20050601
- International Application: PCT/JP2006/309705 WO 20060516
- International Announcement: WO2006/129473 WO 20061207
- Main IPC: B23K26/067
- IPC: B23K26/067

Abstract:
A laser processing apparatus for processing a multitude of portions to be processed in an area to be processed in a subject W to be processed, including a laser device, a focusing or imaging device for laser beams provided by the laser device, and an arranging device for arranging the subject W to be processed, in which the subject W to be processed and the focusing or imaging device are fixed, and the subject to be processed is processed while relatively shifting the laser beams and the focusing or imaging device so that the focusing or imaging device is irradiated from different areas in the laser beam, inside and outside the area to be processed, and that cumulative laser beam irradiation time during the processing of each of the multitude of portions to be processed is equalized.
Public/Granted literature
- US20090032510A1 Laser Processing Apparatus and Laser Processing Method Public/Granted day:2009-02-05
Information query
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