Invention Grant
- Patent Title: Laser beam machining
- Patent Title (中): 激光束加工
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Application No.: US12744216Application Date: 2008-11-20
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Publication No.: US08389893B2Publication Date: 2013-03-05
- Inventor: Michael Kempe , Peter Westphal , Wolfgang Grau , Georg von Freymann
- Applicant: Michael Kempe , Peter Westphal , Wolfgang Grau , Georg von Freymann
- Applicant Address: DE Eggenstein-Leopoldshafen
- Assignee: Nanoscribe GmbH
- Current Assignee: Nanoscribe GmbH
- Current Assignee Address: DE Eggenstein-Leopoldshafen
- Agency: Patterson Thuente Christensen Pedersen, P.A.
- Priority: DE102007055530 20071121
- International Application: PCT/EP2008/009840 WO 20081120
- International Announcement: WO2009/065590 WO 20090528
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/14 ; B23K26/16 ; B23K26/06 ; B23K26/02 ; B23K26/08 ; G02B21/00

Abstract:
A method for laser beam machining of a workpiece in which a laser beam is focused by an objective, into or onto the workpiece having a boundary surface, to produce a machining effect by a two-photon process, and the position of the focal point with respect to the workpiece is shifted. To obtain a reference for the position of the focal point, an image of a luminating modulation object is projected through the objective onto the workpiece into the focal plane or so as to intersect it. Reflections of the image occurring at the boundary surface are imaged into an autofocus image plane, and are detected by a camera. The camera image plane either intersects the autofocus image plane when the image of the illuminating modulation object lies in the focal plane, or lies in the autofocus image plane when the image of the modulation object intersects the focal plane.
Public/Granted literature
- US20100294749A1 LASER BEAM MACHINING Public/Granted day:2010-11-25
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