Invention Grant
- Patent Title: Enclosure of electronic device
- Patent Title (中): 电子设备外壳
-
Application No.: US12841125Application Date: 2010-07-21
-
Publication No.: US08389873B2Publication Date: 2013-03-05
- Inventor: Po-Chuan Hsieh , Yu-Chang Pai , Chien-Hung Liu , Shou-Kuo Hsu
- Applicant: Po-Chuan Hsieh , Yu-Chang Pai , Chien-Hung Liu , Shou-Kuo Hsu
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99113771A 20100430
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H02B1/56

Abstract:
An enclosure of an electronic device includes a plate. The plate defines a number of through holes. A number of shields extend from the plate corresponding to the through holes. Each shield extends outwards from the outer surface of the plate, surrounding and partly covering a corresponding through hole. The enclosure with the shields can shield the electronic device from EMI.
Public/Granted literature
- US20110266046A1 ENCLOSURE OF ELECTRONIC DEVICE Public/Granted day:2011-11-03
Information query