Invention Grant
US08389868B2 Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits
有权
具有电感器的封装集成电路和在封装集成电路中形成电感器的方法
- Patent Title: Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits
- Patent Title (中): 具有电感器的封装集成电路和在封装集成电路中形成电感器的方法
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Application No.: US11967879Application Date: 2007-12-31
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Publication No.: US08389868B2Publication Date: 2013-03-05
- Inventor: Dirk Leipold , Chih-Ming Hung , David W. Evans
- Applicant: Dirk Leipold , Chih-Ming Hung , David W. Evans
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Ronald O. Neerings; Wade James Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H05K1/16
- IPC: H05K1/16
Abstract:
Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits are disclosed. An example method comprises forming a substrate having a first trace and a contact, attaching an integrated circuit to the substrate over the first trace, and electrically coupling the first trace to the contact via an electrical conductor that extends over the integrated circuit to form the inductor in the packaged integrated circuit.
Public/Granted literature
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