Invention Grant
US08389647B2 Laminating adhesive for demoulding at elevated temperature 有权
层压粘合剂用于在高温下脱模

Laminating adhesive for demoulding at elevated temperature
Abstract:
The present invention relates to a laminating adhesive composition, which contains a reaction product which contains isocyanate groups and which is obtained from the reaction of at least two specific polyester polyols, solid at room temperature, and a polyisocyanate. Particularly in the case of three-dimensionally deformed support material surfaces, the laminating adhesive compositions permit removal from the laminating mold at an elevated temperature.
Public/Granted literature
Information query
Patent Agency Ranking
0/0