Invention Grant
- Patent Title: Laminating adhesive for demoulding at elevated temperature
- Patent Title (中): 层压粘合剂用于在高温下脱模
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Application No.: US12379675Application Date: 2009-02-26
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Publication No.: US08389647B2Publication Date: 2013-03-05
- Inventor: Kai Paschkowski
- Applicant: Kai Paschkowski
- Applicant Address: CH Baar
- Assignee: Sika Technology AG
- Current Assignee: Sika Technology AG
- Current Assignee Address: CH Baar
- Agency: Oliff & Berridge, PLC
- Priority: EP08151977 20080227
- Main IPC: C08L75/04
- IPC: C08L75/04 ; C08L75/06

Abstract:
The present invention relates to a laminating adhesive composition, which contains a reaction product which contains isocyanate groups and which is obtained from the reaction of at least two specific polyester polyols, solid at room temperature, and a polyisocyanate. Particularly in the case of three-dimensionally deformed support material surfaces, the laminating adhesive compositions permit removal from the laminating mold at an elevated temperature.
Public/Granted literature
- US20090214875A1 Laminating adhesive for demoulding at elevated temperature Public/Granted day:2009-08-27
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