Invention Grant
US08389611B2 Pressure sensitive adhesive composition for optical members, pressure sensitive adhesive layer for optical members, pressure sensitive adhesive optical member and image display
有权
用于光学构件的压敏粘合剂组合物,用于光学构件的压敏粘合剂层,压敏粘合剂光学构件和图像显示
- Patent Title: Pressure sensitive adhesive composition for optical members, pressure sensitive adhesive layer for optical members, pressure sensitive adhesive optical member and image display
- Patent Title (中): 用于光学构件的压敏粘合剂组合物,用于光学构件的压敏粘合剂层,压敏粘合剂光学构件和图像显示
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Application No.: US11814775Application Date: 2006-01-10
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Publication No.: US08389611B2Publication Date: 2013-03-05
- Inventor: Fumiaki Shirafuji , Masayuki Satake , Kohei Yano , Yutaka Moroishi , Fumiko Nakano
- Applicant: Fumiaki Shirafuji , Masayuki Satake , Kohei Yano , Yutaka Moroishi , Fumiko Nakano
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2005-016933 20050125
- International Application: PCT/JP2006/300131 WO 20060110
- International Announcement: WO2006/080185 WO 20060803
- Main IPC: C08K5/101
- IPC: C08K5/101 ; C08K5/01 ; C08K5/03

Abstract:
An object of the present invention is to provide a pressure sensitive adhesive composition for an optical member, which is excellent in coating property because of low viscosity, can reduce an amount of an organic solvent used, and can form a pressure sensitive adhesive layer excellent in durability and having high surface uniformity. The present invention relates to a pressure sensitive adhesive composition for an optical member, which comprises a (meth)acrylic polymer, a C6 to C9 hydrocarbon-based solvent (A), and a high-boiling highly solubilizing solvent (B) having a boiling point higher than that of the above hydrocarbon-based solvent and having a higher ability to solubilize the (meth)acrylic polymer than that of the above hydrocarbon-based solvent, wherein a content of the hydrocarbon-based solvent (A) is 20 to 60 wt % based on the total amount of the solvents, and a ratio of the content (wt %) of the hydrocarbon-based solvent (A) to the content (wt %) of the high-boiling highly solubilizing solvent (B) (high-boiling highly solubilizing solvent (B)/hydrocarbon-based solvent (A)) is 0.05 to 4.
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