Invention Grant
US08389355B2 Semiconductor integrated circuit device having MIM capacitor and method of fabricating the same
有权
具有MIM电容器的半导体集成电路器件及其制造方法
- Patent Title: Semiconductor integrated circuit device having MIM capacitor and method of fabricating the same
- Patent Title (中): 具有MIM电容器的半导体集成电路器件及其制造方法
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Application No.: US12984823Application Date: 2011-01-05
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Publication No.: US08389355B2Publication Date: 2013-03-05
- Inventor: Seok-Jun Won , Jung-Min Park
- Applicant: Seok-Jun Won , Jung-Min Park
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR10-2006-0045712 20060522
- Main IPC: H01L21/8234
- IPC: H01L21/8234

Abstract:
In a semiconductor integrated circuit device and a method of formation thereof, a semiconductor device comprises: a semiconductor substrate; an insulator at a top portion of the substrate, defining an insulator region; a conductive layer pattern on the substrate, the conductive layer pattern being patterned from a common conductive layer, the conductive layer pattern including a first pattern portion on the insulator in the insulator region and a second pattern portion on the substrate in an active region of the substrate, wherein the second pattern portion comprises a gate of a transistor in the active region; and a capacitor on the insulator in the insulator region, the capacitor including: a lower electrode on the first pattern portion of the conductive layer pattern, a dielectric layer pattern on the lower electrode, and an upper electrode on the dielectric layer pattern.
Public/Granted literature
- US20110097869A1 SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING MIM CAPACITOR AND METHOD OF FABRICATING THE SAME Public/Granted day:2011-04-28
Information query
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