Invention Grant
- Patent Title: Method for manufacturing a semiconductor device
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Application No.: US12719897Application Date: 2010-03-09
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Publication No.: US08389342B2Publication Date: 2013-03-05
- Inventor: Setsuo Nakajima
- Applicant: Setsuo Nakajima
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2001-133518 20010427
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A purpose of the invention is to provide a method for leveling a semiconductor layer without increasing the number and the complication of manufacturing processes as well as without deteriorating a crystal characteristic, and a method for leveling a surface of a semiconductor layer to stabilize an interface between the surface of the semiconductor layer and a gate insulating film, in order to achieve a TFT having a good characteristic. In an atmosphere of one kind or a plural kinds of gas selected from hydrogen or inert gas (nitrogen, argon, helium, neon, krypton and xenon), radiation with a laser beam in the first, second and third conditions is carried out in order, wherein the first condition laser beam is radiated for crystallizing a semiconductor film or improving a crystal characteristic; the second condition laser beam is radiated for eliminating an oxide film; and the third condition laser beam is radiated for leveling a surface of the crystallized semiconductor film.
Public/Granted literature
- US20100155737A1 METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2010-06-24
Information query
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