Invention Grant
- Patent Title: Methods of forming semiconductor chip underfill anchors
- Patent Title (中): 形成半导体芯片底部填充锚的方法
-
Application No.: US13247145Application Date: 2011-09-28
-
Publication No.: US08389340B2Publication Date: 2013-03-05
- Inventor: Roden R. Topacio , Neil McLellan
- Applicant: Roden R. Topacio , Neil McLellan
- Applicant Address: CA Markham
- Assignee: ATI Technologies ULC
- Current Assignee: ATI Technologies ULC
- Current Assignee Address: CA Markham
- Agent Timothy M. Honeycutt
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
Various semiconductor chips and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in an insulating layer applied to a side of a semiconductor chip. The first opening does not extend through to the side. A second opening is formed in the insulating layer that exposes a portion of the side.
Public/Granted literature
- US20120012987A1 METHODS OF FORMING SEMICONDUCTOR CHIP UNDERFILL ANCHORS Public/Granted day:2012-01-19
Information query
IPC分类:
