Invention Grant
- Patent Title: Integrated circuit packaging system with isolated pads and method of manufacture thereof
- Patent Title (中): 具有隔离垫的集成电路封装系统及其制造方法
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Application No.: US13197122Application Date: 2011-08-03
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Publication No.: US08389332B2Publication Date: 2013-03-05
- Inventor: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Lionel Chien Hui Tay , Jose Alvin Caparas
- Applicant: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Lionel Chien Hui Tay , Jose Alvin Caparas
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of manufacture of an integrated circuit packaging system includes: providing a lead frame having a die attach paddle, an isolated pad, and a connector; attaching an integrated circuit die to the die attach paddle and the connector; forming an encapsulation over the integrated circuit die, the connector, the die attach paddle, and the isolated pad; and singulating the connector and the die attach paddle whereby the isolated pads are electrically isolated.
Public/Granted literature
- US20110284999A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ISOLATED PADS AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2011-11-24
Information query
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