Invention Grant
- Patent Title: Integrated circuit packaging system with package stacking and method of manufacture thereof
- Patent Title (中): 具有封装堆叠的集成电路封装系统及其制造方法
-
Application No.: US13118955Application Date: 2011-05-31
-
Publication No.: US08389329B2Publication Date: 2013-03-05
- Inventor: NamJu Cho , HeeJo Chi , HanGil Shin
- Applicant: NamJu Cho , HeeJo Chi , HanGil Shin
- Applicant Address: SG Singapore
- Assignee: STATS ChipPac Ltd.
- Current Assignee: STATS ChipPac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L21/48 ; H01L21/44 ; H01L23/02 ; H01L23/52 ; H01L23/485
Abstract:
A method of manufacture of an integrated circuit packaging system includes: providing a base package carrier; mounting an interposer over the base package carrier; forming a base package encapsulation over the base package carrier and the interposer with the base package encapsulation having a cavity for exposing the interposer; and forming a support recess in the base package encapsulation between a non-horizontal edge of the base package encapsulation and the cavity.
Public/Granted literature
- US20120306102A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2012-12-06
Information query
IPC分类:
