Invention Grant
US08389304B2 Method for producing group III nitride semiconductor light-emitting device
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III族氮化物半导体发光元件的制造方法
- Patent Title: Method for producing group III nitride semiconductor light-emitting device
- Patent Title (中): III族氮化物半导体发光元件的制造方法
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Application No.: US13067142Application Date: 2011-05-11
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Publication No.: US08389304B2Publication Date: 2013-03-05
- Inventor: Toshiya Uemura , Jun Ito
- Applicant: Toshiya Uemura , Jun Ito
- Applicant Address: JP Kiyosu-Shi, Aichi-Ken
- Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee Address: JP Kiyosu-Shi, Aichi-Ken
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2010-111947 20100514
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
The present invention provides a method for producing a Group III nitride semiconductor light-emitting device, the device including a light-emitting layer which is formed so as to contour a stripe-pattern embossment and to have a uniform thickness. In the production method, firstly, a stripe-pattern embossment having a serrated cross section is formed on one surface of a substrate. Subsequently, on the surface of the substrate on the side of the stripe-pattern embossment having a serrated cross section, an n-type layer, a light-emitting layer, and a p-type layer are sequentially deposited through reduced-pressure MOCVD so as to contour the embossment. Thus, each of the layers is formed so as to contour the embossment, and to have a stripe pattern with a serrated cross section. In this MOCVD process, the direction of gas flow is parallel with the direction of the stripe of the embossment. Thus, the light-emitting layer has uniform thickness and composition in an in-plane direction.
Public/Granted literature
- US20110281381A1 Method for producing group III nitride semiconductor light-emitting device Public/Granted day:2011-11-17
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