Invention Grant
US08389197B2 Compound, positive resist composition and resist pattern forming method
失效
化合物,正光刻胶组合物和抗蚀剂图案形成方法
- Patent Title: Compound, positive resist composition and resist pattern forming method
- Patent Title (中): 化合物,正光刻胶组合物和抗蚀剂图案形成方法
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Application No.: US11994602Application Date: 2006-06-30
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Publication No.: US08389197B2Publication Date: 2013-03-05
- Inventor: Takako Hirosaki , Daiju Shiono , Taku Hirayama , Hideo Hada
- Applicant: Takako Hirosaki , Daiju Shiono , Taku Hirayama , Hideo Hada
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2005-196132 20050705
- International Application: PCT/JP2006/313103 WO 20060630
- International Announcement: WO2007/004566 WO 20070111
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/039 ; G03F7/20 ; G03F7/30

Abstract:
The present invention provides a positive resist composition and a resist pattern forming method that are capable of forming a resist pattern with a reduced level of roughness. The positive resist composition includes the compound represented by the general formula (I) below. The present invention also provides the resist pattern forming method using the positive resist composition above. [wherein, in formula (I), R11 and R12 each represents, independently, an alkyl group of 1 to 10 carbon atoms or an aromatic hydrocarbon group, and may include a hetero atom in the structure thereof; R21 to R24 each represents, independently, a hydrogen atom or an acid dissociable, dissolution inhibiting group, and two of the R21 to R24 represents a hydrogen atom and the others represents an acid dissociable, dissolution inhibiting group; X is a group represented by general formulas (Ia) or (Ib) below].
Public/Granted literature
- US20090117488A1 COMPOUND, POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD Public/Granted day:2009-05-07
Information query
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