Invention Grant
- Patent Title: Photosensitive resin composition
- Patent Title (中): 感光树脂组合物
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Application No.: US12440155Application Date: 2007-09-04
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Publication No.: US08389116B2Publication Date: 2013-03-05
- Inventor: Shinji Funakoshi , Koshi Okita , Hiroshi Yamada , Kei Tomeba
- Applicant: Shinji Funakoshi , Koshi Okita , Hiroshi Yamada , Kei Tomeba
- Applicant Address: JP Tokyo
- Assignee: Asahi Kasel Chemicals Corporation
- Current Assignee: Asahi Kasel Chemicals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2006-241170 20060906; JP2007-173864 20070702
- International Application: PCT/JP2007/067160 WO 20070904
- International Announcement: WO2008/029777 WO 20080313
- Main IPC: B32B17/10
- IPC: B32B17/10

Abstract:
Problem to be SolvedTo provide a photosensitive resin composition which has good processability even in a relatively low temperature condition near room temperature and exhibits good efficiency in removing debris generated while shaping a printing plate by laser engraving.SolutionA photosensitive resin composition, characterized by comprising: (a) 100 parts by mass of a resin having a number average molecular weight of 1,000 or more; and (b) 0.1 to 10 parts by mass of ultrafine particles having a number average particle diameter of primary particles of 5 nm or more and 100 nm or less; wherein the photosensitive resin composition has a viscosity at 20° C. of 50 Pa·s or more and 10,000 Pa·s or less; and a precursor composition, which is obtained by excluding the component (b) from the photosensitive resin composition, has a viscosity at 20° C. of 5 Pa·s or more and 500 Pa·s or less.
Public/Granted literature
- US20100189941A1 PHOTOSENSITIVE RESIN COMPOSITION Public/Granted day:2010-07-29
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