Invention Grant
- Patent Title: Method of cleaning powdery source supply system, storage medium, substrate processing system and substrate processing method
- Patent Title (中): 清洁粉末源供应系统,储存介质,基板处理系统和基板处理方法
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Application No.: US12593945Application Date: 2008-03-26
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Publication No.: US08389053B2Publication Date: 2013-03-05
- Inventor: Tsuyoshi Moriya , Toshio Hasegawa , Hideaki Yamasaki
- Applicant: Tsuyoshi Moriya , Toshio Hasegawa , Hideaki Yamasaki
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-092379 20070330
- International Application: PCT/JP2008/056509 WO 20080326
- International Announcement: WO2008/120794 WO 20081009
- Main IPC: B05D1/12
- IPC: B05D1/12 ; C23C16/00

Abstract:
A method of cleaning a powdery source supply system prevents outflow of particles from a chamber or an introduction line in a film forming process. A substrate processing system includes a powdery source supply system and a film forming processing unit. The powdery source supply system includes an ampoule for accommodating a powdery source, a carrier gas supply unit for supplying a carrier gas into the ampoule, an introduction line for connecting the ampoule and the film forming processing unit, a purge line branched from the introduction line, and a valve for opening or closing the introduction line. When the valve is opened and the interior of the purge line is evacuated prior to the film forming process, the carrier gas supply unit supplies a carrier gas so that the viscous force acting on particles by the carrier gas is greater than the viscous force in the film forming process.
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