The use of induction furnaces for producing thermoelectric legs and components for thermoelectric modules is described, as is a process for producing thermoelectric semiconductor materials by co-melting mixtures of the particular element constituents of the thermoelectric semiconductor materials or alloys thereof in an induction furnace and pouring the melt thus obtained into the mold of a thermoelectric leg, or spraying the melt thus obtained to produce a pulverulent thermoelectric semiconductor material.