Invention Grant
- Patent Title: Hot-melt molding apparatus
- Patent Title (中): 热熔成型装置
-
Application No.: US12969011Application Date: 2010-12-15
-
Publication No.: US08388874B2Publication Date: 2013-03-05
- Inventor: Kenichi Fuse
- Applicant: Kenichi Fuse
- Applicant Address: US DE Wilmington
- Assignee: Empire Technology Development LLC
- Current Assignee: Empire Technology Development LLC
- Current Assignee Address: US DE Wilmington
- Agency: Maschoff Gilmore & Israelsen
- Priority: JP2010-056236 20100312
- Main IPC: B29C45/74
- IPC: B29C45/74 ; B29C47/78

Abstract:
A hot-melt molding apparatus includes an apparatus body, a cylinder, a molding head, a heating device, a conveyor screw, a heat transport section, a thermoelectric element, and a power storage section. The cylinder communicates with the apparatus body and is configured to receive thermoplastic material. The molding head is provided at one end of the cylinder. The heating device is configured to heat the cylinder and the molding head to melt thermoplastic material therein. The conveyor screw is provided inside the cylinder to convey thermoplastic material to the molding head. The heat transport section has a first end connected to at least one of the cylinder and the molding head. The thermoelectric conversion element is connected to a second end of the heat transport section. The power storage section is connected to the thermoelectric conversion element and is configured to store power generated by the thermoelectric conversion element.
Public/Granted literature
- US20110221088A1 HOT-MELT MOLDING APPARATUS Public/Granted day:2011-09-15
Information query