Invention Grant
- Patent Title: Non-contact substrate processing
- Patent Title (中): 非接触式基板加工
-
Application No.: US12701047Application Date: 2010-02-05
-
Publication No.: US08388853B2Publication Date: 2013-03-05
- Inventor: Blake Koelmel , Nyi O. Myo
- Applicant: Blake Koelmel , Nyi O. Myo
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: C23F1/00
- IPC: C23F1/00
Abstract:
Embodiments of the present invention provide apparatus and methods for supporting, positioning or rotating a semiconductor substrate during processing. One embodiment of the present invention provides a method for processing a substrate comprising positioning the substrate on a substrate receiving surface of a susceptor, and rotating the susceptor and the substrate by delivering flow of fluid from one or more rotating ports.
Public/Granted literature
- US20100200545A1 NON-CONTACT SUBSTRATE PROCESSING Public/Granted day:2010-08-12
Information query
