Invention Grant
- Patent Title: Process for producing adhesive patch
- Patent Title (中): 生产贴片的方法
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Application No.: US12503375Application Date: 2009-07-15
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Publication No.: US08388794B2Publication Date: 2013-03-05
- Inventor: Ryo Hashino , Masakatsu Konno , Jun Harima
- Applicant: Ryo Hashino , Masakatsu Konno , Jun Harima
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-184670 20080716
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B32B37/00 ; B32B38/04

Abstract:
The invention provides a process for producing an adhesive patch, which includes a step of preparing a pressure-sensitive adhesive sheet including a backing, a pressure-sensitive adhesive layer formed on at least one side of the backing, and a release liner disposed on the pressure-sensitive adhesive layer; and a step of punching an adhesive patch including a backing, a pressure-sensitive adhesive layer formed on at least one side of the backing, and a release liner disposed on the pressure-sensitive adhesive layer out of the pressure-sensitive adhesive sheet with a protrudent push cutter blade, in which, at at least an edge part of the protrudent push cutter blade, a cross-sectional shape of the protrudent push cutter blade, which is in a direction perpendicular to the direction in which the protrudent push cutter blade extends, has an angle a and an angle b, in which the angle a is larger than the angle b. The angle a and angle b in the sectional shape have the meanings described in the specification.
Public/Granted literature
- US20100012266A1 PROCESS FOR PRODUCING ADHESIVE PATCH Public/Granted day:2010-01-21
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