Invention Grant
- Patent Title: Method for fabricating camera module
- Patent Title (中): 相机模块制作方法
-
Application No.: US13219948Application Date: 2011-08-29
-
Publication No.: US08388793B1Publication Date: 2013-03-05
- Inventor: Tzy-Ying Lin , Chieh-Yuan Cheng , Hung-Yeh Lin
- Applicant: Tzy-Ying Lin , Chieh-Yuan Cheng , Hung-Yeh Lin
- Applicant Address: TW Hsinchu US CA Santa Clara
- Assignee: VisEra Technologies Company Limited,OmniVision Technologies, Inc.
- Current Assignee: VisEra Technologies Company Limited,OmniVision Technologies, Inc.
- Current Assignee Address: TW Hsinchu US CA Santa Clara
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B32B38/04 ; B32B38/10 ; B32B43/00

Abstract:
The invention provides a method for fabricating a camera module. An exemplary embodiment of the method for fabricating a camera module comprises providing plurality of lens sets. A dry film layer is formed on the plurality of lens sets. The dry film layer is patterned to form a plurality of dry film patterns respectively attaching to a plurality of lens sets. The plurality of lens sets are separated. A lens set separated from the plurality of lens sets is bonded to an image sensor device chip. The dry film pattern on the lens set is removed.
Public/Granted literature
- US20130048208A1 METHOD FOR FABRICATING CAMERA MODULE Public/Granted day:2013-02-28
Information query