Invention Grant
- Patent Title: Print head with reduced bonding stress and method
- Patent Title (中): 打印头具有降低的粘合应力和方法
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Application No.: US12538655Application Date: 2009-08-10
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Publication No.: US08388778B2Publication Date: 2013-03-05
- Inventor: Haggai Karlinski , Gil Fisher , Roi Nathan , Ilan Weiss
- Applicant: Haggai Karlinski , Gil Fisher , Roi Nathan , Ilan Weiss
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B41J2/14
- IPC: B41J2/14
Abstract:
A method for reducing stress between a silicon chip and a bonded mounting structure having a coefficient of thermal expansion substantially different from a coefficient of thermal expansion of the silicon chip includes the step of bonding a thermal stress-attenuating layer between the silicon chip and the mounting structure. The thermal stress-attenuating layer has a coefficient of thermal expansion that is substantially similar to the coefficient of thermal expansion of the silicon chip.
Public/Granted literature
- US20100032075A1 PRINT HEAD WITH REDUCED BONDING STRESS AND METHOD Public/Granted day:2010-02-11
Information query
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